Lapox fillo – 1.8kg set for electrical potting applications

Description Lapox Fillo is two component modified, thixotropic epoxy adhesive system. When both components are mixed in recommended ratios and cured appropriately at room temperature, an excellent bond
strength can be achieved with most of the substrates including glass, metals, reactive plastics, wood,
textile and natural stones. Faster productivity can be achieved, if curing is performed at higher
temperature between 40°C and 60°C. Curing at higher temperature is recommended to achieve
optimum bond strength.
Applications

Joint filling system for flooring

Potting system for small electronics
Wood industries
Advantages Good electrical insulating properties
High bond strength
Mechanical strength even in dynamic conditions
Thermally stable and suitable to perform in extreme conditions
Water and chemical resistant