Dielectric Class • 20 kV/mmBONDONE® SUPER SPEED – Elctrical Epoxy Adhesive System
HSC 7110 Epoxy Resin & HSC 8200 Polyamide Hardener | High Dielectric Electrical Insulation, Potting & Structural Assembly
Product Overview
BONDONE® SUPER SPEED is a thixotropic, room-temperature curing two-component epoxy resin and polyamide hardener system developed by Hindusthan Speciality Chemicals Limited (HSCL). Composed of HSC 7110 Resin (milky white liquid) and HSC 8200 Hardener (amber liquid), it is formulated to deliver high mechanical strength, very low cure shrinkage, and outstanding chemical and moisture resistance.
With a certified electric strength of 20 kV/mm and a volume resistivity of 10¹⁵ Ω·cm, this system acts as a reliable dielectric insulation coating, potting compound, and structural adhesive for electrical switchgear, bus bars, transformer coils, terminal blocks, and electronic enclosures.
Key Technical Features
- High Dielectric Isolation: Electric breakdown resistance of 20 kV/mm (IEC 60243-1) with volume resistivity of 10¹⁵ Ω·cm (IEC 60093).
- Thixotropic & Non-Sagging: Controlled viscosity (30,000–40,000 mPas) enables clean placement without dripping or sagging on vertical conductors.
- Superior Bond Strength: Achieves a minimum lap shear strength of 100 kg/cm² on aluminum strips and cures to a rigid 74 Shore D hardness.
- Low Water Absorption: 24-hour water absorption rate of 0.22% wt protects against atmospheric humidity and corrosion.
- Balanced Working Window: 60–80 minutes pot life (100g at 25°C) ensures adequate assembly time, reaching hard-dry state in 200–220 minutes at 35°C.
Technical Specifications (As per HSCL TDS)
| Property Parameter | Standard | Technical Value |
|---|---|---|
| Resin Component (Part A) | Visual / HTP-1 | HSC 7110 (Milky White Liquid / Thixotropic) |
| Hardener Component (Part B) | Visual / ASTM D1544 | HSC 8200 (Amber Liquid, Max 8 Gardner) |
| Mixing Ratio (Resin : Hardener) | Weight / Pbw | 100 : 80 |
| Viscosity at 25°C | ASTM D2196 | 30,000 – 40,000 mPas (Both Components) |
| Density at 25°C | ASTM D891 | Resin: 1.2 g/cc | Hardener: 0.95 g/cc |
| Pot Life (100g at 25°C) | ASTM D2471 | 60 – 80 Minutes |
| Surface / Touch Dry (35°C) | ASTM D5895 | 50–60 min / 120–130 min |
| Hard Dry Time (35°C) | ASTM D5895 | 200 – 220 Minutes |
| Full Functional Cure | Ambient (25°C) | 24 Hours (Heat accelerates cure) |
| Dielectric / Electric Strength | IEC 60243-1 | 20 kV/mm |
| Volume Resistivity | IEC 60093 | 10¹⁵ Ω·cm |
| Lap Shear Strength (Al Strip) | ASTM D1002 | Min 100 kg/cm² |
| Cured Hardness | HTP-22 | 74 Shore D |
| Water Absorption (24h at 25°C) | HTP-53 | 0.22 % weight |
| Available Packaging | HSCL Standard | 450 g, 900 g, 1.8 kg, 9 kg, 54 kg, 90 kg |
| Shelf Life | Sealed Containers | 24 Months from manufacturing date |
Surface Preparation & Application Guidelines
- Surface Cleaning: Degrease joint surfaces thoroughly using acetone, toluene, or trichloroethylene to eliminate grease, oil, and dust. Avoid unapproved thinners or alcohol.
- Mechanical Abrasion: Abrade mating areas using coarse emery cloth or chemical etching for superior mechanical grip, followed by a final degreasing pass.
- Accurate Mixing: Proportion 100 parts HSC 7110 Resin with 80 parts HSC 8200 Hardener by weight. Blend thoroughly until the mix achieves a homogeneous, streak-free consistency.
- Application: Apply using a spatula or brush to obtain an optimal joint layer thickness of 0.1 mm to 0.2 mm. Assemble parts with contact pressure using a clamp or jig until set. Cures fully in 24 hours at room temperature.
