BONDONE® SUPER SPEED Epoxy Adhesive – Electrical insulation and potting.

​High-Performance Dielectric Potting & Structural Bonding Compound
(HSC 7110 Epoxy Resin + HSC 8200 Polyamide Hardener)
​Product Overview
​BONDONE® SUPER SPEED is an industrial-grade, thixotropic, two-component room-temperature curing epoxy system developed by Hindusthan Speciality Chemicals Limited (HSCL). Engineered with a non-sagging consistency and balanced working time, it provides robust dielectric isolation, dimensional stability, and high mechanical strength for critical electrical, electronic, and structural assemblies.
​The system comprises HSC 7110 Resin (milky white paste) and HSC 8200 Hardener (amber liquid). It cures with negligible shrinkage to form a tough, moisture-resistant barrier that protects electrical conductors, bus bars, transformer coils, and potted electronic circuits against dielectric breakdown, short circuits, and environmental contaminants.
​Key Technical Advantages
​Dielectric Protection: Certified electric strength of 20 kV/mm (IEC 60243-1) combined with an ultra-high volume resistivity of 10^{15}\ \Omega\cdot\text{cm} (IEC 60093) prevents arcing and electrical tracking.
​Thixotropic, Non-Drip Formulation: Paste-like consistency (30,000–40,000 mPas) stays firmly in place without sagging or running into unsealed voids on vertical and overhead applications.
​High Mechanical & Bond Integrity: Delivers a minimum lap shear strength of 100 kg/cm² on aluminum substrates and cures to a rigid 74 Shore D hardness.
​Moisture & Chemical Defense: Ultra-low water absorption rate (0.22% wt after 24 hours at 25°C) resists humidity degradation, chemical splashing, and thermal aging.
​Controlled Curing Schedule: Features a comfortable pot life of 60–80 minutes (100g mass at 25°C), reaching hard-dry state in 200–220 minutes at 35°C, with complete cure in 24 hours at ambient temperature.
​Target Applications
​Electrical Insulation & Potting: Insulation coating for bus bar joints, phase barriers, terminals, transformers, solenoid coils, and electronic modules.
​Structural Assembly: High-strength joining of metal-to-metal (copper, brass, aluminum, steel), metal-to-non-metal, and glass assemblies.
​Composite & Plastic Joining: Bonding engineering plastics, FRP/GRP laminates, ceramics, and porcelain insulators.
​Component Encapsulation: Sealing control panels, junction boxes, switchgear assemblies, and automotive electronic housings against moisture and vibration.